Authors:	M. Duperron, L. Carroll, M. Rensing, S. Collins, Y. Zhao, Y. Li, R. Baets, P. O'Brien
Title:	Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device
Format:	International Conference Proceedings
Publication date:	2/2017
Journal/Conference/Book:	Proc. SPIE 10109, Optical Interconnects XVII
Editor/Publisher:	SPIE,
Volume(Issue):	10109 p.1010915 (17 Pages)
Location:	San Francisco, United States
DOI:	10.1117/12.2250921
Citations:	10 (Dimensions.ai - last update: 24/11/2024) 6 (OpenCitations - last update: 27/6/2024) Look up on Google Scholar
Download:	(1.8MB)

Abstract

The cost-effective integration of laser sources on Silicon Photonic Integrated Circuits (Si-PICs) is a key challenge to realizing the full potential of on-chip photonic solutions for telecommunication and medical applications. Hybrid integration can offer a route to high-yield solutions, using only known-good laser-chips, and simple freespace micro-optics to transport light from a discrete laser-diode to a grating-coupler on the Si-PIC. In this work, we describe a passively assembled micro-optical bench (MOB) for the hybrid integration of a 1550nm 20MHz linewidth laser-diode on a Si-PIC, developed for an on-chip interferometer based medical device. A dual-lens MOB design minimizes aberrations in the laser spot transported to the standard grating-coupler (15 μm x 12 μm) on the Si-PIC, and facilitates the inclusion of a sub-millimeter latched-garnet optical-isolator. The 20dB suppression from the isolator helps ensure the high-frequency stability of the laser-diode, while the high thermal conductivity of the AlN submount (300/W=m.°C), and the close integration of a micro-bead thermistor, ensure the stable and efficient thermo-electric cooling of the laser-diode, which helps minimise low-frequency drift during the approximately ~ 15s of operation needed for the point-of-care measurement. The dual-lens MOB is compatible with cost-effective passively-aligned mass-production, and can be optimised for alternative PIC-based applications.