Authors:	J.-M. Fedeli, F. Schrank, W. Bogaerts, A. Masood, L.Zimmermann, E. Augendre, S. Bernabe, J. Kraft, P. Grosse, T. Enot
Title:	Electronic-Photonic Integration in the Helios Project
Format:	International Conference Proceedings
Publication date:	8/2013
Journal/Conference/Book:	Group IV Photonics (invited)
Editor/Publisher:	IEEE,
Volume(Issue):	p.FB1
Location:	Seoul, South Korea
DOI:	10.1109/group4.2013.6644413
Citations:	1 (Dimensions.ai - last update: 24/11/2024) Look up on Google Scholar
Download:	(1.2MB)

Abstract

Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria

Related Research Topics

• 3D Integration of Photonics & CMOS using Cu Through-Silicon-Via (2008-2013)

Related Projects

• ICT: HELIOS (pHotonics ELectronics functional Integration on CMOS)