Authors:	C. Stamatiadis, F. Gomez-Agis, L. Stampoulidis, K. Vyrsokinos, I. Lazarou, H.J.S. Dorren, L. Zimmermann, K. Voigt, D. Van Thourhout, P. De Heyn, H. Avramopoulos
Title:	The BOOM project: towards 160 Gb/s packet switching using SOI photonic integrated circuits and hybrid integrated optical flip-flops
Format:	International Journal
Publication date:	1/2012
Journal/Conference/Book:	Journal of Lightwave Technology
Volume(Issue):	30(1) p.22-30
DOI:	10.1109/jlt.2011.2175901
Citations:	7 (Dimensions.ai - last update: 24/11/2024) 5 (OpenCitations - last update: 10/5/2024) Look up on Google Scholar
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Abstract

We present a 160 Gb/s optical packet switching architecture
that performs label detection and packet wavelength conversion
using photonic components integrated on silicon-on-insulator
(SOI) waveguide boards. For label detection, we report the
fabrication of a 4-channel tunable, second-order microring resonator
demultiplexer using the SOI nanowire waveguide platform.
For all-optical wavelength conversion we report the integration
and packaging of a cascaded SOI delay interferometer (DI) structure
using SOI rib waveguides. Both components were assembled
with an optical flip-flop to enable 160 Gb/s optical packet switching.
The power penalty after the wavelength conversion process was
��  dB with error performance well above the FEC limit. This
work is part of the European ICT-BOOM project which aims at
building a Tb/s photonic router using hybrid and heterogeneous integration
on SOI substrates. The preliminary results reported here
is the initial step before the final project demonstrator.