| Authors: | L. Zimmermann, H. Schroeder, T. Tekin, W. Bogaerts, P. Dumon | | Title: | g-Pack – a generic testbed package for Silicon photonic devices | | Format: | International Conference Proceedings | | Publication date: | 9/2008 | | Journal/Conference/Book: | Group IV Photonics
| | Volume(Issue): | p.FB4 | | Location: | Sorrento, Italy | | DOI: | 10.1109/group4.2008.4638203 | | Citations: | 7 (Dimensions.ai - last update: 24/11/2024)
1 (OpenCitations - last update: 3/5/2024)
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Abstract
g-Pack is a low-frequency packaging approach to
breadboarding of Silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier. Related Research Topics
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