Authors:	G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Notzel, M. Smit
Title:	Adhesive Bonding of InP/InGaAsP Dies to Processed Silicon-on-Insulator Wafers using DVS-bis-Benzocyclobutene
Format:	International Journal
Publication date:	11/2006
Journal/Conference/Book:	Journal of Electrochemical Society
Volume(Issue):	153(12) p.G1015-G1019
DOI:	10.1149/1.2352045
Citations:	111 (Dimensions.ai - last update: 24/11/2024) 91 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
Download:	(691KB)

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)

Related Projects

• IST: PICMOS (Photonic Interconnect Layer on CMOS by wafer-scale integration)
• IWT: epSOC (electro-photonic System-On-Chip)