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H2020 : PhotonicLEAP

Full Name: ​Photonic Wafer-Level IntEgration PAckaging and Test Processes

Duration: 1/1/2021-31/12/2024

Project Web site: https://photonicleap.com/index.html

People involved

Research topics involved

See also:

  • https://cordis.europa.eu/project/id/101016738

Publications in the framework of this project (4)

    International Journals

  1. E. Dieussaert, R. Baets, H. Jans, X. Rottenberg, Y. Li, Non-contact photoacoustic imaging with a silicon photonics-based Laser Doppler Vibrometer, Scientific Reports, 14, p.22953 doi:10.1038/s41598-024-74266-y (2024)  Download this Publication (2.3MB).
      International Conferences

    1. Y. Li, E. Dieussaert, M. Ghomashi, R. Baets, Silicon photonics-based laser Doppler vibrometer array for non-contact photoacoustic imaging, International Conference on Nano-photonics and Nano-optoelectronics, Japan, p.ICNN5-01 (2024).
    2. K. Shortiss, H.-Y. Hwang, J. Parra, S. Butler, H.-C. Wang, M. Ghomashi, Y. Li, W. Noell, M. Seyfried, P. O'Brien, Automating Photonic Systems-in-Package Assembly for High Performance Glass Interposers, 50th European Conference on Optical Communication, Germany, p.W2A.33 (2023).
    3. M. Ghomashi, R. Baets, Y. Li, Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits, 2023 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), Italy, doi:10.1109/NUSOD59562.2023.10273523 (2023).